Overview
An evaporator uses an electric resistance heater or high-energy beam to melt material
and to raise its vapor pressure to a useful range. This process takes place in a high
vacuum state to allow the vapor to reach the substrate without reacting with or
scattering against other gas-phase atoms in the chamber while reducing the
incorporation of impurities from the residual gas in the vacuum chamber. The KVE Series
evaporation systems are capable of fabricating multi-layer thin films by applying this
co-deposition process.
Features
≻ Excellent Thickness Uniformity
The KVE Series E-Beam&Sputter Evaporator System provide excellent thickness uniformity of
resultant films. And if you deposit the thin films to same condition, you will get the thin
films of same feature.
≻ Combination system
This system has E-beam source and sputtering source. Therefore, you can deposit
thin films of various properties.
Overview
An evaporator uses an electric resistance heater or high-energy beam to melt material
and to raise its vapor pressure to a useful range. This process takes place in a high
vacuum state to allow the vapor to reach the substrate without reacting with or
scattering against other gas-phase atoms in the chamber while reducing the
incorporation of impurities from the residual gas in the vacuum chamber. The KVE Series
evaporation systems are capable of fabricating multi-layer thin films by applying this
co-deposition process.
Features
≻ Excellent Thickness Uniformity
The KVE Series E-Beam&Sputter Evaporator System provide excellent thickness uniformity of
resultant films. And if you deposit the thin films to same condition, you will get the thin
films of same feature.
≻ Combination system
This system has E-beam source and sputtering source. Therefore, you can deposit
thin films of various properties.
Specifications
ITEM |
SPECIFICATIONS |
Process Chamber |
Stainless steel |
Vacuum Pumping Station |
Cryo, TMP |
Loadlock Chamber |
Optional item |
Substrate Unit |
Rotation / Heating |
Sample Size |
4inch ~ |
Process pressure |
< 5.0E-4Torr |
Vacuum Gauge Controller |
ATM ~ 1.0E-10Torr |
Power Supply Unit |
6kW, 8kW, 10kW |
Crucible Size |
4cc, 7cc, 15cc, 25cc |
Pocket Number |
Single, 4,6 |
Sputtering Cathode |
4”,6” 600W, 1000W |
Film Thickness Uniformity |
< ±5% |
Ultimate Pressure |
< 5.0E-7Torr |
System Control |
PC auto / PLC Semi-auto |
Specifications
ITEM |
SPECIFICATIONS |
Process Chamber |
Stainless steel |
Vacuum Pumping Station |
Cryo, TMP |
Loadlock Chamber |
Optional item |
Substrate Unit |
Rotation / Heating |
Sample Size |
4inch ~ |
Process pressure |
< 5.0E-4Torr |
Vacuum Gauge Controller |
ATM ~ 1.0E-10Torr |
Power Supply Unit |
6kW, 8kW, 10kW |
Crucible Size |
4cc, 7cc, 15cc, 25cc |
Pocket Number |
Single, 4,6 |
Sputtering Cathode |
4”,6” 600W, 1000W |
Film Thickness Uniformity |
< ±5% |
Ultimate Pressure |
< 5.0E-7Torr |
System Control |
PC auto / PLC Semi-auto
|
System Control
Pumping
This screen shows the pumping screen. This screen consists of each valve, pump action button, automatic button, P, Q, S tap. The biggest difference from Semi Auto is the automatic button, so if you proceed with these buttons in sequence, one sample will be completed. |
|
|
X-Y Sweeper
The picture shows the X-Y sweeper screen. This window can be saved pattern of e-beam to files. You can also load saved files. By entering various patterns for each pocket, you can get a stable deposition rate according to the characteristics of the source.
|
Recipe
The figure shows the recipe screen. This screen contains boxes for entering the process conditions required for deposition. Input all the boxes and press the Process button to automatically deposit according to the input process conditions.
|
|
|
Graph
The figure shows the graph screen. This screen shows vacuum degree, power amount, deposition rate, thickness and so on. You can record that data and make it into a file and compare it with the previous data.
|
Message
The picture is a graph screen. The picture consists of status message notification messages
|
|
System Control
Pumping
This screen shows the pumping screen. This screen consists of each valve, pump action button, automatic button, P, Q, S tap. The biggest difference from Semi Auto is the automatic button, so if you proceed with these buttons in sequence, one sample will be completed. |
|
|
X-Y Sweeper
The picture shows the X-Y sweeper screen. This window can be saved pattern of e-beam to files. You can also load saved files. By entering various patterns for each pocket, you can get a stable deposition rate according to the characteristics of the source.
|
Recipe
The figure shows the recipe screen. This screen contains boxes for entering the process conditions required for deposition. Input all the boxes and press the Process button to automatically deposit according to the input process conditions.
|
|
|
Graph
The figure shows the graph screen. This screen shows vacuum degree, power amount, deposition rate, thickness and so on. You can record that data and make it into a file and compare it with the previous data.
|
Message
The picture is a graph screen. The picture consists of status message notification messages
|
|
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