Overview
A New Standard for Precision Alloy and Composite Multilayer Thin Film Processing: Multi-Function PVD System
Overcoming the limitations of single deposition processes, this is a perfectly integrated solution for advanced device research requiring the highest thin film quality and interfacial properties. This system integrates a Magnetron Sputter, excellent for alloy deposition, and an Electron Beam Evaporator, advantageous for forming high-purity thin films, into a single high-vacuum chamber.
In particular, it is optimized for research on composite multilayer thin films requiring precise electrical characteristics. Through an in-situ process that performs two deposition processes consecutively without atmospheric exposure (vacuum breakdown), researchers can realize the highest quality electronic devices completely free from oxidation and interfacial contamination.
Overview
A New Standard for Precision Alloy and Composite Multilayer Thin Film Processing: Multi-Function PVD System
Overcoming the limitations of single deposition processes, this is a perfectly integrated solution for advanced device research requiring the highest thin film quality and interfacial properties. This system integrates a Magnetron Sputter, excellent for alloy deposition, and an Electron Beam Evaporator, advantageous for forming high-purity thin films, into a single high-vacuum chamber.
In particular, it is optimized for research on composite multilayer thin films requiring precise electrical characteristics. Through an in-situ process that performs two deposition processes consecutively without atmospheric exposure (vacuum breakdown), researchers can realize the highest quality electronic devices completely free from oxidation and interfacial contamination.
Specifications
|
ITEM |
SPECIFICATIONS |
|
Process Chamber |
Stainless steel |
|
Vacuum Pumping Station |
Turbo molecular pump |
|
Loadlock Chamber |
Stainless steel |
|
Substrate Heating Unit |
SiC / 4”, 6” |
|
Sample Loading/Unloading Unit |
Full auto / Semi-auto |
|
Pressure Control Unit |
Automatic |
|
Vacuum Gauge Controller |
ATM ~ 1.0E-10Torr |
|
Gas Supply Unit |
MFC (Ar, O2, N2, H2, etc..) |
|
Power Supply Unit |
E-Beam, RF / DC / Pulsed DC |
|
Target Size |
2” |
|
Film Thickness Uniformity |
Less than ± 2.99 % |
|
Ultimate Pressure |
Less than 1.99E-7 Torr / 1 Hour (Process Chamber) Less than 4.99E-3 Torr / 1 Hour (loadlock Chamber)
|
| CE Certification | Acquired |
Specifications
|
ITEM |
SPECIFICATIONS |
|
Process Chamber |
Stainless steel |
|
Vacuum Pumping Station |
Turbo molecular pump |
|
Loadlock Chamber |
Stainless steel |
|
Substrate Heating Unit |
SiC / 4”, 6” |
|
Sample Loading/Unloading Unit |
Full auto / Semi-auto |
|
Pressure Control Unit |
Automatic |
|
Vacuum Gauge Controller |
ATM ~ 1.0E-10Torr |
|
Gas Supply Unit |
MFC (Ar, O2, N2, H2, etc..) |
|
Power Supply Unit |
E-Beam, RF / DC / Pulsed DC |
|
Target Size |
2” |
|
Film Thickness Uniformity |
Less than ± 2.99 % |
|
Ultimate Pressure |
Less than 1.99E-7 Torr / 1 Hour (Process Chamber) Less than 4.99E-3 Torr / 1 Hour (loadlock Chamber)
|
| CE Certification | Acquired |
Options
- Etc... user requirements
Options
- Etc... user requirements
System Control
- Automatic Control
System Control
- Automatic Control
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