Overview
Korea Vacuum Tech, Ltd. (KVT) is proud to introduce the latest revolutionary addition to
our product line, the Intelsi-M Multi-Function PVD system. Despite its compact
convenient size, easy operation and affordability, functionality is in no way sacrificed.
The Intelsi-M is capable of thin film deposition utilizing Sputter, E-Beam and Thermal
Source technologies and can accommodate variable material types in sample sizes up to
3" (75mm). The modular design of the Intelsi-M makes it highly configurable to meet
specific customer needs and numerous stock options are also available. A fully
automated Laptop PC helps round out this extremely usable yet robust diminutive
package.
Advantages
≻ Easy to install, easy to operate
≻ Precise reproducible coatings - consistent
≻ Fully adaptable to a wide range of specimens
≻ Compact design / small footprint
≻ Quick and simple loading / unloading
Features
≻ Extreme versatility
≻ High capacity vacuum pumping
≻ Fully automated PC control
≻ Capable of producing very thin resultant films
Overview
Korea Vacuum Tech, Ltd. (KVT) is proud to introduce the latest revolutionary addition to
our product line, the Intelsi-M Multi-Function PVD system. Despite its compact
convenient size, easy operation and affordability, functionality is in no way sacrificed.
The Intelsi-M is capable of thin film deposition utilizing Sputter, E-Beam and Thermal
Source technologies and can accommodate variable material types in sample sizes up to
3" (75mm). The modular design of the Intelsi-M makes it highly configurable to meet
specific customer needs and numerous stock options are also available. A fully
automated Laptop PC helps round out this extremely usable yet robust diminutive
package.
Advantages
≻ Easy to install, easy to operate
≻ Precise reproducible coatings - consistent
≻ Fully adaptable to a wide range of specimens
≻ Compact design / small footprint
≻ Quick and simple loading / unloading
Features
≻ Extreme versatility
≻ High capacity vacuum pumping
≻ Fully automated PC control
≻ Capable of producing very thin resultant films
Specifications
ITEM |
SPECIFICATIONS |
Process Chamber |
Stainless steel |
Vacuum Pumping Station |
Turbo molecular pump |
Loadlock Chamber |
Stainless steel |
Substrate Heating Unit |
SiC / 3” |
Sample Loading/Unloading Unit |
Manual |
Pressure Control Unit |
Auto |
Vacuum Gauge Controller |
ATM ~ 1.0E-10Torr |
Gas Supply Unit |
MFC (Ar, O2, etc..) |
Power Supply Unit |
DC / AC |
Deposition Source |
Sputtering Cathode 1EA, Thermal Source 2EA |
Target & Boat |
2" Target, 1/2” (w) x 2 (L) x 0.2 (T) Boat |
Film Thickness Uniformity |
Less than ±5% |
Ultimate Pressure |
Less than 5.0E-7Torr |
Specifications
ITEM |
SPECIFICATIONS |
Process Chamber |
Stainless steel |
Vacuum Pumping Station |
Turbo molecular pump |
Loadlock Chamber |
Stainless steel |
Substrate Heating Unit |
SiC / 3” |
Sample Loading/Unloading Unit |
Manual |
Pressure Control Unit |
Auto |
Vacuum Gauge Controller |
ATM ~ 1.0E-10Torr |
Gas Supply Unit |
MFC (Ar, O2, etc..) |
Power Supply Unit |
DC / AC |
Deposition Source |
Sputtering Cathode 1EA, Thermal Source 2EA |
Target & Boat |
2" Target, 1/2” (w) x 2 (L) x 0.2 (T) Boat |
Film Thickness Uniformity |
Less than ±5% |
Ultimate Pressure |
Less than 5.0E-7Torr |
Options
ITEM |
SPECIFICATIONS |
|||
Description |
Intelsi-MM |
Intelsi-MS1 |
Intelsi-MS2 |
Intelsi-ME |
Chamber |
SUS304, Circle type, Top door open |
|||
Dimensions |
M: 830(W) x 892(D) x 1150(H) |
|||
E-Beam Source |
Single pocket – 1.5cc |
N/A |
N/A |
4cc-6pockets/7cc- 4pockets |
E-Beam Power Supply |
3kW E-Beam power supply |
N/A |
N/A |
6kW E-Beam power supply |
Gas Supply |
Ar MFC control (Optional O2 MFC, N2 MFC) |
N/A |
||
Pressure Control |
Manual throttle valve (Optional Auto Throttle Valve) |
N/A |
||
Process |
Ultimate pressure : less than 5 x 10E-6 torr |
|||
Deposition Uniformity |
less than ±5% @ 2 inch |
less than ±5% @ 3 inch |
less than ±5% @ 3 inch |
|
Sputtering Source |
Target size : 1 inch |
Target: 1 inch -3ea |
Target size : 2inch – 3ea |
N/A |
Sputtering Power Supply |
1kW RF Power Supply |
1kW DC Power Supply |
N/A |
|
Substrate |
Size : up to 3” piece |
up to 3” piece |
up to 3” piece |
|
Rotation Speed |
Rotation : 0 – 30 RPM |
|||
Heater |
Heating : up to 800°C by SiC heating element |
|||
System Control |
PLC based PC control |
|||
System Software |
Software : Labview |
|||
Thermal Source |
W boat or basket type |
N/A |
N/A |
N/A |
Thermal Power Supply |
3kW DC power supply |
N/A |
N/A |
N/A |
Utilities |
Electric Power : 220V, 3P, 30A |
|||
|
PCW : 1 ~ 2 kgf/cm2, 10 L/M |
|||
|
CDA : 6 ~ 7 kgf/cm2 |
|||
Vacuum Gauge |
PLC interface communication |
|||
Vacuum Pumping |
Turbo Molecular Pump + Rotary pump |
|||
Weight |
~ 300 kg (~660 pound ) |
Options
ITEM |
SPECIFICATIONS |
|||
Description |
Intelsi-MM |
Intelsi-MS1 |
Intelsi-MS2 |
Intelsi-ME |
Chamber |
SUS304, Circle type, Top door open |
|||
Dimensions |
M: 830(W) x 892(D) x 1150(H) |
|||
E-Beam Source |
Single pocket – 1.5cc |
N/A |
N/A |
4cc-6pockets/7cc- 4pockets |
E-Beam Power Supply |
3kW E-Beam power supply |
N/A |
N/A |
6kW E-Beam power supply |
Gas Supply |
Ar MFC control (Optional O2 MFC, N2 MFC) |
N/A |
||
Pressure Control |
Manual throttle valve (Optional Auto Throttle Valve) |
N/A |
||
Process |
Ultimate pressure : less than 5 x 10E-6 torr |
|||
Deposition Uniformity |
less than ±5% @ 2 inch |
less than ±5% @ 3 inch |
less than ±5% @ 3 inch |
|
Sputtering Source |
Target size : 1 inch |
Target: 1 inch -3ea |
Target size : 2inch – 3ea |
N/A |
Sputtering Power Supply |
1kW RF Power Supply |
1kW DC Power Supply |
N/A |
|
Substrate |
Size : up to 3” piece |
up to 3” piece |
up to 3” piece |
|
Rotation Speed |
Rotation : 0 – 30 RPM |
|||
Heater |
Heating : up to 800°C by SiC heating element |
|||
System Control |
PLC based PC control |
|||
System Software |
Software : Labview |
|||
Thermal Source |
W boat or basket type |
N/A |
N/A |
N/A |
Thermal Power Supply |
3kW DC power supply |
N/A |
N/A |
N/A |
Utilities |
Electric Power : 220V, 3P, 30A |
|||
|
PCW : 1 ~ 2 kgf/cm2, 10 L/M |
|||
|
CDA : 6 ~ 7 kgf/cm2 |
|||
Vacuum Gauge |
PLC interface communication |
|||
Vacuum Pumping |
Turbo Molecular Pump + Rotary pump |
|||
Weight |
~ 300 kg (~660 pound ) |
System Control
Vacuum
This screen shows the pumping screen. This screen consists of each valve, pump action button, automatic button. The biggest difference from Semi Auto is the automatic button, so if you proceed with these buttons in sequence, one sample will be completed. |
|
|
Process
The figure shows the process screen. This screen shows the buttons that can control the gas flow rate, valve, power etc. required for the process. |
Graph
The figure shows the graph screen. This screen shows vacuum degree, power amount and so on. You can record that data and make it into a file and compare it with the previous data. |
|
|
Message
The picture is a graph screen. The picture consists of status message notification messages |
System Control
Vacuum
This screen shows the pumping screen. This screen consists of each valve, pump action button, automatic button. The biggest difference from Semi Auto is the automatic button, so if you proceed with these buttons in sequence, one sample will be completed. |
|
|
Process
The figure shows the process screen. This screen shows the buttons that can control the gas flow rate, valve, power etc. required for the process. |
Graph
The figure shows the graph screen. This screen shows vacuum degree, power amount and so on. You can record that data and make it into a file and compare it with the previous data. |
|
|
Message
The picture is a graph screen. The picture consists of status message notification messages |
|