E-beam & Thermal Evaporator System [KVE-ET Series] > E-beam & Thermal Series
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제품 정보
제품 상세설명
Overview
An evaporator uses an electric resistance heater or high-energy beam to melt material and to raise its vapor pressure to a useful range. This process takes place in a high
vacuum state to allow the vapor to reach the substrate without reacting with or scattering against other gas-phase atoms in the chamber while reducing the incorporation of impurities from the residual gas in the vacuum chamber. The KVE Series evaporation systems are capable of fabricating multi-layer thin films by applying this co-deposition process.
Features
≻ Excellent Thickness Uniformity
The KVE Series E-Beam&Thermal Evaporator System provide excellent thickness uniformity
of resultant films. And if you deposit the thin films to same condition, you will get the thin
films of same feature.
≻ Combination system
This system has E-beam source and thermal source. Therefore, you can deposit thin
films of various properties.
Overview
An evaporator uses an electric resistance heater or high-energy beam to melt material and to raise its vapor pressure to a useful range. This process takes place in a high
vacuum state to allow the vapor to reach the substrate without reacting with or scattering against other gas-phase atoms in the chamber while reducing the incorporation of impurities from the residual gas in the vacuum chamber. The KVE Series evaporation systems are capable of fabricating multi-layer thin films by applying this co-deposition process.
Features
≻ Excellent Thickness Uniformity
The KVE Series E-Beam&Thermal Evaporator System provide excellent thickness uniformity
of resultant films. And if you deposit the thin films to same condition, you will get the thin
films of same feature.
≻ Combination system
This system has E-beam source and thermal source. Therefore, you can deposit thin
films of various properties.
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Specifications
제품 Specifications
Specifications
ITEM
SPECIFICATIONS
Process Chamber
Stainless steel
Vacuum Pumping Station
Turbo Molecular Pump/Cryogenic Pump
Loadlock Chamber
Optional item
Substrate Unit
Heating / Cooling, Rotation
Sample Size
4inch ~ 12 inch
Process pressure
< 5.0E-4Torr
Vacuum Gauge Controller
ATM ~ 1.0E-10Torr
Power Supply Unit
6kW, 8kW, 10kW
Crucible Size
4cc, 7cc, 15cc, 25cc
Pocket Number
Single, 4, 6
Thermal source
Max. 4ea
Film Thickness Uniformity
< ± 2.99 %
Ultimate Pressure
< 1.99E-7 Torr
System Control
Automatic / Semi-auto
Specifications
ITEM
SPECIFICATIONS
Process Chamber
Stainless steel
Vacuum Pumping Station
Turbo Molecular Pump/Cryogenic Pump
Loadlock Chamber
Optional item
Substrate Unit
Heating / Cooling, Rotation
Sample Size
4inch ~ 12 inch
Process pressure
< 5.0E-4Torr
Vacuum Gauge Controller
ATM ~ 1.0E-10Torr
Power Supply Unit
6kW, 8kW, 10kW
Crucible Size
4cc, 7cc, 15cc, 25cc
Pocket Number
Single, 4, 6
Thermal source
Max. 4ea
Film Thickness Uniformity
< ± 2.99 %
Ultimate Pressure
< 1.99E-7 Torr
System Control
Automatic / Semi-auto
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Options
제품 Options
Options
- Loadlock Chamber
- Sample Cleaning
- N2 Substrate Cooling
- Dome Type Substrate
- Rotation & Revolution
- O2 etc... Gas
- Arc free type e-beam source
Options
- Loadlock Chamber
- Sample Cleaning
- N2 Substrate Cooling
- Dome Type Substrate
- Rotation & Revolution
- O2 etc... Gas
- Arc free type e-beam source
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Control
제품 Control
System Control
Pumping
This screen shows the pumping screen. This screen consists of each valve, pump action button, automatic button, P, Q, S tap. The biggest difference from Semi Auto is the automatic button, so if you proceed with these buttons in sequence, one sample will be completed.
X-Y Sweeper
The picture shows the X-Y sweeper screen. This window can be saved pattern of e-beam to files. You can also load saved files. By entering various patterns for each pocket, you can get a stable deposition rate according to the characteristics of the source.
Recipe
The figure shows the recipe screen. This screen contains boxes for entering the process conditions required for deposition. Input all the boxes and press the Process button to automatically deposit according to the input process conditions.
Graph
The figure shows the graph screen. This screen shows vacuum degree, power amount, deposition rate, thickness and so on. You can record that data and make it into a file and compare it with the previous data.
Message
The picture is a graph screen. The picture consists of status message notification messages
System Control
Pumping
This screen shows the pumping screen. This screen consists of each valve, pump action button, automatic button, P, Q, S tap. The biggest difference from Semi Auto is the automatic button, so if you proceed with these buttons in sequence, one sample will be completed.
X-Y Sweeper
The picture shows the X-Y sweeper screen. This window can be saved pattern of e-beam to files. You can also load saved files. By entering various patterns for each pocket, you can get a stable deposition rate according to the characteristics of the source.
Recipe
The figure shows the recipe screen. This screen contains boxes for entering the process conditions required for deposition. Input all the boxes and press the Process button to automatically deposit according to the input process conditions.
Graph
The figure shows the graph screen. This screen shows vacuum degree, power amount, deposition rate, thickness and so on. You can record that data and make it into a file and compare it with the previous data.
Message
The picture is a graph screen. The picture consists of status message notification messages
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