Overview
Korea Vacuum Tech, Ltd. (KVT) is proud to introduce the latest revolutionary addition
to our product line, the CVD system. Chemical Vapor Deposition is a chemical reactive
process used to produce high-purity, high-performance solid materials in a vacuum state.
In a typical CVD process, the wafer (substrate) is exposed to one or more volatile precursors
which react and / or decompose on the substrate surface to produce a desired deposit.
Plasma Enhanced Chemical Vapor Deposition (PECVD) is a unique form of the CVD
process used primarily to deposit thin films from a gaseous state (vapor) to a solid state
on some substrate. PECVD is not dependent upon thermal energy alone to create of
maintain a chemical reaction but rather it uses RF-enhanced glow discharge to convey
energy to a reactive gas which subsequently, in a vacuum environment, sets the
conditions necessary for effective thin film deposition.
Features
≻ Compared to other CVD application, PECVD allows for operations in
a high-vacuum, low-temp environment
≻ Specially designed gas shower head provides uniform gas flow – consistent
film thickness over a surface
≻ Can distribute multiple gases, independently about the substrate and mixed
outside of gas shower head
≻ Semi – or Fully- Automate processing available
≻ Capable of multi-layer, co-deposition processing
≻ High deposition rates-fast!
Overview
Korea Vacuum Tech, Ltd. (KVT) is proud to introduce the latest revolutionary addition
to our product line, the CVD system. Chemical Vapor Deposition is a chemical reactive
process used to produce high-purity, high-performance solid materials in a vacuum state.
In a typical CVD process, the wafer (substrate) is exposed to one or more volatile precursors
which react and / or decompose on the substrate surface to produce a desired deposit.
Plasma Enhanced Chemical Vapor Deposition (PECVD) is a unique form of the CVD
process used primarily to deposit thin films from a gaseous state (vapor) to a solid state
on some substrate. PECVD is not dependent upon thermal energy alone to create of
maintain a chemical reaction but rather it uses RF-enhanced glow discharge to convey
energy to a reactive gas which subsequently, in a vacuum environment, sets the
conditions necessary for effective thin film deposition.
Features
≻ Compared to other CVD application, PECVD allows for operations in
a high-vacuum, low-temp environment
≻ Specially designed gas shower head provides uniform gas flow – consistent
film thickness over a surface
≻ Can distribute multiple gases, independently about the substrate and mixed
outside of gas shower head
≻ Semi – or Fully- Automate processing available
≻ Capable of multi-layer, co-deposition processing
≻ High deposition rates-fast!
Specifications
ITEM |
SPECIFICATIONS |
|||
Process Chamber |
Material : SUS304 / Anodized Al6061 |
|||
Loadlock Chamber |
N/A |
|||
Vacuum Pumping Station |
TMP & Dry Pump |
|||
Gas shower Head |
Shower Head with insulator/RF bias electrode isolation |
|||
Pressure Control |
Auto Throttle Valve & CDG Sensor |
|||
Substrate Heating Type |
- Heating element size: 4” ~ 6” - Heating element type: SiC, Molded |
|||
Gas Supply Unit |
Mass Flow Controller & valve |
|||
Plasma Source |
RF generator with matching network |
|||
Process control |
KVC-P4000 |
KVC-P4000L |
KVC-P2000 |
KVC-P2000L |
PC Control By Labview |
PC Control By Labview |
Semi-Auto |
Semi-Auto |
Specifications
ITEM |
SPECIFICATIONS |
|||
Process Chamber |
Material : SUS304 / Anodized Al6061 |
|||
Loadlock Chamber |
N/A |
|||
Vacuum Pumping Station |
TMP & Dry Pump |
|||
Gas shower Head |
Shower Head with insulator/RF bias electrode isolation |
|||
Pressure Control |
Auto Throttle Valve & CDG Sensor |
|||
Substrate Heating Type |
- Heating element size: 4” ~ 6” - Heating element type: SiC, Molded |
|||
Gas Supply Unit |
Mass Flow Controller & valve |
|||
Plasma Source |
RF generator with matching network |
|||
Process control |
KVC-P4000 |
KVC-P4000L |
KVC-P2000 |
KVC-P2000L |
PC Control By Labview |
PC Control By Labview |
Semi-Auto |
Semi-Auto |
System Control
Pumping The figure shows the pumping screen. Pumping screens have valves and pumps. The pump and valve are easily operated with one touch. |
|
|
Gas Control This picture shows the gas control screen. |
Interlock
This picture shows the interlock screen. Basically, the interlock is set so that it does not work when you deviate from the correct method of use for your safety.
|
|
System Control
Pumping The figure shows the pumping screen. Pumping screens have valves and pumps. The pump and valve are easily operated with one touch. |
|
|
Gas Control This picture shows the gas control screen. |
Interlock
This picture shows the interlock screen. Basically, the interlock is set so that it does not work when you deviate from the correct method of use for your safety.
|
|