Overview
Korea Vacuum Tech, Ltd. (KVT) is proud to introduce the latest revolutionary addition
to our product line, the CVD system. Chemical Vapor Deposition is a chemical reactive
process used to produce high-purity, high-performance solid materials in a vacuum state.
In a typical CVD process, the wafer (substrate) is exposed to one or more volatile precursors
which react and / or decompose on the substrate surface to produce a desired deposit.
Plasma Enhanced Chemical Vapor Deposition (PECVD) is a unique form of the CVD
process used primarily to deposit thin films from a gaseous state (vapor) to a solid state
on some substrate. PECVD is not dependent upon thermal energy alone to create of
maintain a chemical reaction but rather it uses RF-enhanced glow discharge to convey
energy to a reactive gas which subsequently, in a vacuum environment, sets the
conditions necessary for effective thin film deposition.
Features
≻ Compared to other CVD application, PECVD allows for operations in
a high-vacuum, low-temp environment
≻ Specially designed gas shower head provides uniform gas flow – consistent
film thickness over a surface
≻ Can distribute multiple gases, independently about the substrate and mixed
outside of gas shower head
≻ Semi – or Fully- Automate processing available
≻ Capable of multi-layer, co-deposition processing
≻ High deposition rates-fast!
Overview
Korea Vacuum Tech, Ltd. (KVT) is proud to introduce the latest revolutionary addition
to our product line, the CVD system. Chemical Vapor Deposition is a chemical reactive
process used to produce high-purity, high-performance solid materials in a vacuum state.
In a typical CVD process, the wafer (substrate) is exposed to one or more volatile precursors
which react and / or decompose on the substrate surface to produce a desired deposit.
Plasma Enhanced Chemical Vapor Deposition (PECVD) is a unique form of the CVD
process used primarily to deposit thin films from a gaseous state (vapor) to a solid state
on some substrate. PECVD is not dependent upon thermal energy alone to create of
maintain a chemical reaction but rather it uses RF-enhanced glow discharge to convey
energy to a reactive gas which subsequently, in a vacuum environment, sets the
conditions necessary for effective thin film deposition.
Features
≻ Compared to other CVD application, PECVD allows for operations in
a high-vacuum, low-temp environment
≻ Specially designed gas shower head provides uniform gas flow – consistent
film thickness over a surface
≻ Can distribute multiple gases, independently about the substrate and mixed
outside of gas shower head
≻ Semi – or Fully- Automate processing available
≻ Capable of multi-layer, co-deposition processing
≻ High deposition rates-fast!
Specifications
ITEM |
SPECIFICATIONS |
|||
Processs Chamber
|
Material : SUS304 / Anodized Al6061 |
|||
Loadlock Chamber |
KVC-X000L Series available |
|||
Vacuum Pumping Station |
TMP & Dry Pump |
|||
Gas shower Head |
Shower Head with insulator/RF bias electrode isolation |
|||
Pressure Control |
Auto Throttle Valve & CDG Sensor |
|||
Substrate Heating Type |
- Heating element size: 4” ~ 6” - Heating element type: SiC, Molded |
|||
Gas Supply Unit |
Mass Flow Controller & valve |
|||
Plasma Source |
RF generator with matching network |
|||
Process control |
KVC-P4000 |
KVC-P4000L |
KVC-P2000 |
KVC-P2000L |
PC Control By Labview |
PC Control By Labview |
Semi-Auto |
Semi-Auto |
Specifications
ITEM |
SPECIFICATIONS |
|||
Processs Chamber
|
Material : SUS304 / Anodized Al6061 |
|||
Loadlock Chamber |
KVC-X000L Series available |
|||
Vacuum Pumping Station |
TMP & Dry Pump |
|||
Gas shower Head |
Shower Head with insulator/RF bias electrode isolation |
|||
Pressure Control |
Auto Throttle Valve & CDG Sensor |
|||
Substrate Heating Type |
- Heating element size: 4” ~ 6” - Heating element type: SiC, Molded |
|||
Gas Supply Unit |
Mass Flow Controller & valve |
|||
Plasma Source |
RF generator with matching network |
|||
Process control |
KVC-P4000 |
KVC-P4000L |
KVC-P2000 |
KVC-P2000L |
PC Control By Labview |
PC Control By Labview |
Semi-Auto |
Semi-Auto |
System Control
Vacuum
This screen shows the vacuum screen. This screen consists of each valve, pump action button, automatic button. The automatic function provides convenience to the user. if you proceed with these buttons in sequence, one sample will be completed.
|
|
|
Recipe
The figureshows the recipe screen. This screen contains
boxes for entering the process conditions required
for deposition. Input all the boxes and press the
Process button to automatically deposit according to
the input process conditions.
|
Process
The figure shows the process screen. This screen shows the buttons that can control the gas flow rate, valve, power etc. required for the process. |
|
|
Transfer
The figure shows the Transfer screen. In this screen, there are buttons that allow you to manipulate the part you will use to move samples from the load lock chamber to the process chamber, such as the loading arm, z- motion. |
Graph
The figure shows the graph screen. This screen shows vacuum degree, power amount, deposition rate, thickness and so on. You can record that data and make it into a file and compare it with the previous data. |
|
|
Message
The picture is a graph screen. The picture consists of status message notification messages
|
System Control
Vacuum
This screen shows the vacuum screen. This screen consists of each valve, pump action button, automatic button. The automatic function provides convenience to the user. if you proceed with these buttons in sequence, one sample will be completed.
|
|
|
Recipe
The figureshows the recipe screen. This screen contains
boxes for entering the process conditions required
for deposition. Input all the boxes and press the
Process button to automatically deposit according to
the input process conditions.
|
Process
The figure shows the process screen. This screen shows the buttons that can control the gas flow rate, valve, power etc. required for the process. |
|
|
Transfer
The figure shows the Transfer screen. In this screen, there are buttons that allow you to manipulate the part you will use to move samples from the load lock chamber to the process chamber, such as the loading arm, z- motion. |
Graph
The figure shows the graph screen. This screen shows vacuum degree, power amount, deposition rate, thickness and so on. You can record that data and make it into a file and compare it with the previous data. |
|
|
Message
The picture is a graph screen. The picture consists of status message notification messages
|