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PECVD Series

CVD VACUUM EQUIPMENTS

Korea Vacuum Tech, Ltd. (KVT) is proud to introduce the latest revolutionary addition to our product line, the CVD system. Chemical Vapor Deposition is a chemical reactive process used to produce high-purity, high-performance soli

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  • 제품 정보

    제품 상세설명

    Overview


     

    Korea Vacuum Tech, Ltd. (KVT) is proud to introduce the latest revolutionary addition

     

    to our product line, the CVD system. Chemical Vapor Deposition is a chemical reactive

     

    process used to produce high-purity, high-performance solid materials in a vacuum state.

     

    In a typical CVD process, the wafer (substrate) is exposed to one or more volatile precursors

    which react and / or decompose on the substrate surface to produce a desired deposit.

     

    Plasma Enhanced Chemical Vapor Deposition (PECVD) is a unique form of the CVD

     

    process used primarily to deposit thin films from a gaseous state (vapor) to a solid state

     

    on some substrate. PECVD is not dependent upon thermal energy alone to create of

     

    maintain a chemical reaction but rather it uses RF-enhanced glow discharge to convey

     

    energy to a reactive gas which subsequently, in a vacuum environment, sets the

     

    conditions necessary for effective thin film deposition.

     

     

     

    Features

     

     

     

     Compared to other CVD application, PECVD allows for operations in

     

    a high-vacuum, low-temp environment

     

     

     

     Specially designed gas shower head provides uniform gas flow – consistent

     

    film thickness over a surface

     

     

     

     Can distribute multiple gases, independently about the substrate and mixed

     

    outside of gas shower head

     

     

     

     Semi – or Fully- Automate processing available

     

     

     

     Capable of multi-layer, co-deposition processing

     

     

     

     High deposition rates-fast!


    Overview


     

    Korea Vacuum Tech, Ltd. (KVT) is proud to introduce the latest revolutionary addition

     

    to our product line, the CVD system. Chemical Vapor Deposition is a chemical reactive

     

    process used to produce high-purity, high-performance solid materials in a vacuum state.

     

    In a typical CVD process, the wafer (substrate) is exposed to one or more volatile precursors

    which react and / or decompose on the substrate surface to produce a desired deposit.

     

    Plasma Enhanced Chemical Vapor Deposition (PECVD) is a unique form of the CVD

     

    process used primarily to deposit thin films from a gaseous state (vapor) to a solid state

     

    on some substrate. PECVD is not dependent upon thermal energy alone to create of

     

    maintain a chemical reaction but rather it uses RF-enhanced glow discharge to convey

     

    energy to a reactive gas which subsequently, in a vacuum environment, sets the

     

    conditions necessary for effective thin film deposition.

     

     

     

    Features

     

     

     

     Compared to other CVD application, PECVD allows for operations in

     

    a high-vacuum, low-temp environment

     

     

     

     Specially designed gas shower head provides uniform gas flow – consistent

     

    film thickness over a surface

     

     

     

     Can distribute multiple gases, independently about the substrate and mixed

     

    outside of gas shower head

     

     

     

     Semi – or Fully- Automate processing available

     

     

     

     Capable of multi-layer, co-deposition processing

     

     

     

     High deposition rates-fast!


  • Specifications

    제품 Specifications

    Specifications

     

     ITEM

     SPECIFICATIONS

    Processs Chamber

    Material : SUS304 / Anodized Al6061

    Loadlock Chamber

    KVC-X000L Series available

    Vacuum Pumping Station

    TMP & Dry Pump

    Gas shower Head

    Shower Head with insulator/RF bias electrode isolation

    Pressure Control

    Auto Throttle Valve & CDG Sensor

    Substrate Heating Type

    - Heating element size: 4” ~ 6”

    - Heating element type: SiC, Molded

    Gas Supply Unit

    Mass Flow Controller & valve

    Plasma Source

    RF generator with matching network

    Process control

    KVC-P4000

    KVC-P4000L 

    KVC-P2000 

    KVC-P2000L 

    PC Control

    By Labview

    PC Control

    By Labview 

    Semi-Auto 

    Semi-Auto 

    Specifications

     

     ITEM

     SPECIFICATIONS

    Processs Chamber

    Material : SUS304 / Anodized Al6061

    Loadlock Chamber

    KVC-X000L Series available

    Vacuum Pumping Station

    TMP & Dry Pump

    Gas shower Head

    Shower Head with insulator/RF bias electrode isolation

    Pressure Control

    Auto Throttle Valve & CDG Sensor

    Substrate Heating Type

    - Heating element size: 4” ~ 6”

    - Heating element type: SiC, Molded

    Gas Supply Unit

    Mass Flow Controller & valve

    Plasma Source

    RF generator with matching network

    Process control

    KVC-P4000

    KVC-P4000L 

    KVC-P2000 

    KVC-P2000L 

    PC Control

    By Labview

    PC Control

    By Labview 

    Semi-Auto 

    Semi-Auto 

  • Options

  • Control

    제품 Control

     

    System Control


          Vacuum

     

          This screen shows the vacuum screen. This  

         screen consists of each valve, pump action button, 

         automatic button. The automatic function provides 

         convenience to the user. if you proceed with these 

         buttons in sequence, one sample will be completed.



    o_1btu0cs3u15gv1a2b1fu6p6d35pa.png


    o_1btu0d9j314tg6pc8376revsa.png

     

         Recipe

     

         The figureshows the recipe screen. This screen contains 

     

         boxes for entering the process conditions required 

     

         for deposition. Input all the boxes and press the 

     

        Process button to automatically deposit according to 

     

        the input process conditions.

        Process


        The figure shows the process screen. This screen    

       shows the buttons that can control the gas flow 

       rate, valve, power etc. required for the process.

     


    o_1btu0dk6k113k19cv1rq218h2fina.png

    o_1btu0dvu21grj1aluant17oi1brua.png


       Transfer


       The figure shows the Transfer screen. In this screen,

      there are buttons that allow you to manipulate the part 

      you will use to move samples from the load lock chamber 

      to the process chamber, such as the loading arm, z-

      motion. 

     

         Graph


         The figure shows the graph screen. This screen 

        shows vacuum degree, power amount, deposition 

        rate, thickness and so on. You can record that 

        data and make it into a file and compare it with 

        the previous data.


    o_1btu0ebk014ndc82kb11vk4glaa.png


    o_1btu0f1943n3jpu20giap1kpda.png

     

          Message


          The picture is a graph screen. The picture consists of 

         status message notification messages


     

    System Control


          Vacuum

     

          This screen shows the vacuum screen. This  

         screen consists of each valve, pump action button, 

         automatic button. The automatic function provides 

         convenience to the user. if you proceed with these 

         buttons in sequence, one sample will be completed.



    o_1btu0cs3u15gv1a2b1fu6p6d35pa.png


    o_1btu0d9j314tg6pc8376revsa.png

     

         Recipe

     

         The figureshows the recipe screen. This screen contains 

     

         boxes for entering the process conditions required 

     

         for deposition. Input all the boxes and press the 

     

        Process button to automatically deposit according to 

     

        the input process conditions.

        Process


        The figure shows the process screen. This screen    

       shows the buttons that can control the gas flow 

       rate, valve, power etc. required for the process.

     


    o_1btu0dk6k113k19cv1rq218h2fina.png

    o_1btu0dvu21grj1aluant17oi1brua.png


       Transfer


       The figure shows the Transfer screen. In this screen,

      there are buttons that allow you to manipulate the part 

      you will use to move samples from the load lock chamber 

      to the process chamber, such as the loading arm, z-

      motion. 

     

         Graph


         The figure shows the graph screen. This screen 

        shows vacuum degree, power amount, deposition 

        rate, thickness and so on. You can record that 

        data and make it into a file and compare it with 

        the previous data.


    o_1btu0ebk014ndc82kb11vk4glaa.png


    o_1btu0f1943n3jpu20giap1kpda.png

     

          Message


          The picture is a graph screen. The picture consists of 

         status message notification messages


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