Overview

This is a multi-faceted integrated vacuum deposition equipment designed to research, develop, and produce initial prototypes of ultra-small LED chips (each measuring 100 μm or less) that are the core of high-resolution, high-efficiency Micro LED displays. Unlike typical large-scale mass production lines, it features a compact structure optimized for laboratories and pilot lines, while being capable of forming high-quality thin films without contamination between modules.

Features

• Prevention of interfacial contamination through in-situ processes: During electrode deposition after mesa etching or thin film deposition after cleaning, the substrate is transported while maintaining an ultra-high vacuum state without being removed to the atmosphere, thereby completely preventing device performance degradation caused by surface oxidation or moisture adsorption.

• Process Flexibility: The chamber configuration can be modified to suit research and development purposes, or new modules (e.g., cells for organic material deposition) can be added for future expansion.

• Space and Cost Efficiency: Compared to large-scale mass production cluster equipment, it has a smaller footprint, allowing for deployment within limited laboratory space. Furthermore, it is optimized for small-volume wafer processing, enabling reduced running costs.

Options

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System Control 

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