KVE-EG Series > E-BEAM Series
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제품 정보
제품 상세설명
Overview
An evaporator uses an electric resistance heater or high-energy beam to melt material
and to raise its vapor pressure to a useful range. This process takes place in a high
vacuum state to allow the vapor to reach the substrate without reacting with or
scattering against other gas-phase atoms in the chamber while reducing the
incorporation of impurities from the residual gas in the vacuum chamber. The KVE Series
evaporation systems are capable of fabricating multi-layer thin films by applying this
co-deposition process.
Features
≻ Excellent Thickness Uniformity
The KVE Series GLAD E-Beam Evaporator System provide excellent thickness uniformity of
resultant films. if you deposit the thin film under same conditions, you will get a thin films
of same characteristics
≻ Control the angle of substrate
This system includes the ability to adjust the angle of substrate. So you can deposit the thin
film which have various orientation.
≻ Always maintain high vacuum degree in process
The systems have a process chamber and a loadlock chamber(option).
Loadlock chamber(option) is used for sample loading.
So process chamber is maintained high vacuum state always.
Overview
An evaporator uses an electric resistance heater or high-energy beam to melt material
and to raise its vapor pressure to a useful range. This process takes place in a high
vacuum state to allow the vapor to reach the substrate without reacting with or
scattering against other gas-phase atoms in the chamber while reducing the
incorporation of impurities from the residual gas in the vacuum chamber. The KVE Series
evaporation systems are capable of fabricating multi-layer thin films by applying this
co-deposition process.
Features
≻ Excellent Thickness Uniformity
The KVE Series GLAD E-Beam Evaporator System provide excellent thickness uniformity of
resultant films. if you deposit the thin film under same conditions, you will get a thin films
of same characteristics
≻ Control the angle of substrate
This system includes the ability to adjust the angle of substrate. So you can deposit the thin
film which have various orientation.
≻ Always maintain high vacuum degree in process
The systems have a process chamber and a loadlock chamber(option).
Loadlock chamber(option) is used for sample loading.
So process chamber is maintained high vacuum state always.
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Specifications
제품 Specifications
Specifications
ITEM
SPECIFICATIONS
Process Chamber
Stainless steel
Vacuum Pumping Station
Cryo, TMP
Loadlock Chamber
Optional item
Substrate Unit
Rotation / Heating
Substrate Angle
0 ~ 90°
Sample Size
4”, 6”
Vacuum Gauge Controller
ATM ~ 1.0E-10Torr
Power Supply Unit
6kW, 8kW, 10kW
Crucible Size
4cc, 7cc, 15cc, 25cc
Pocket Number
Single, 4,6
Film Thickness Uniformity
< ±5%
Ultimate Pressure
< 5.0E-7Torr
System Control
PC auto / PLC Semi-auto
Specifications
ITEM
SPECIFICATIONS
Process Chamber
Stainless steel
Vacuum Pumping Station
Cryo, TMP
Loadlock Chamber
Optional item
Substrate Unit
Rotation / Heating
Substrate Angle
0 ~ 90°
Sample Size
4”, 6”
Vacuum Gauge Controller
ATM ~ 1.0E-10Torr
Power Supply Unit
6kW, 8kW, 10kW
Crucible Size
4cc, 7cc, 15cc, 25cc
Pocket Number
Single, 4,6
Film Thickness Uniformity
< ±5%
Ultimate Pressure
< 5.0E-7Torr
System Control
PC auto / PLC Semi-auto
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Options
제품 Options
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Control
제품 Control
System Control
Pumping
This screen shows the pumping screen. This screen consists of each valve, pump action button, automatic button, P, Q, S tap. The biggest difference from Semi Auto is the automatic button, so if you proceed with these buttons in sequence, one sample will be completed.
X-Y Sweeper
The picture shows the X-Y sweeper screen. This window can be saved pattern of e-beam to files. You can also load saved files. By entering various patterns for each pocket, you can get a stable deposition rate according to the characteristics of the source.
Recipe
The figure shows the recipe screen. This screen contains boxes for entering the process conditions required for deposition. Input all the boxes and press the Process button to automatically deposit according to the input process conditions.
Graph
The figure shows the graph screen. This screen shows vacuum degree, power amount, deposition rate, thickness and so on. You can record that data and make it into a file and compare it with the previous data.
Message
The picture is a graph screen. The picture consists of status message notification messages
System Control
Pumping
This screen shows the pumping screen. This screen consists of each valve, pump action button, automatic button, P, Q, S tap. The biggest difference from Semi Auto is the automatic button, so if you proceed with these buttons in sequence, one sample will be completed.
X-Y Sweeper
The picture shows the X-Y sweeper screen. This window can be saved pattern of e-beam to files. You can also load saved files. By entering various patterns for each pocket, you can get a stable deposition rate according to the characteristics of the source.
Recipe
The figure shows the recipe screen. This screen contains boxes for entering the process conditions required for deposition. Input all the boxes and press the Process button to automatically deposit according to the input process conditions.
Graph
The figure shows the graph screen. This screen shows vacuum degree, power amount, deposition rate, thickness and so on. You can record that data and make it into a file and compare it with the previous data.
Message
The picture is a graph screen. The picture consists of status message notification messages
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사용후기
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상품문의
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배송/교환정보
[배송]
배송 안내 입력전입니다.[교환]
교환/반품 안내 입력전입니다.
선택된 옵션
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KVE-EG Series+0원
