Overview
An evaporator uses an electric resistance heater or high-energy beam to melt material
and to raise its vapor pressure to a useful range. This process takes place in a high
vacuum state to allow the vapor to reach the substrate without reacting with or
scattering against other gas-phase atoms in the chamber while reducing the
incorporation of impurities from the residual gas in the vacuum chamber. The KVE Series
evaporation systems are capable of fabricating multi-layer thin films by applying this
co-deposition process.
Features
≻ Excellent Thickness Uniformity
The KVE Series KVE-2000L System provide excellent thickness uniformity of resultant
films.
≻ Always maintain high vacuum degree in process
These systems have a process chamber and a loadlock chamber. Loadlock chamber is used
for sample loading. So process chamber is always maintained high vacuum state
≻ Semi-auto system control by PLC
Overview
An evaporator uses an electric resistance heater or high-energy beam to melt material
and to raise its vapor pressure to a useful range. This process takes place in a high
vacuum state to allow the vapor to reach the substrate without reacting with or
scattering against other gas-phase atoms in the chamber while reducing the
incorporation of impurities from the residual gas in the vacuum chamber. The KVE Series
evaporation systems are capable of fabricating multi-layer thin films by applying this
co-deposition process.
Features
≻ Excellent Thickness Uniformity
The KVE Series KVE-2000L System provide excellent thickness uniformity of resultant
films.
≻ Always maintain high vacuum degree in process
These systems have a process chamber and a loadlock chamber. Loadlock chamber is used
for sample loading. So process chamber is always maintained high vacuum state
≻ Semi-auto system control by PLC
specifications
ITEM |
SPECIFICATIONS |
Process Chamber |
Stainless steel |
Vacuum Pumping Station |
Cryo / TMP |
Loadlock Chamber |
Top door, Stainless steel |
Substrate Unit |
Rotation / Heating / Cooling |
Sample Size |
4inch ~ |
Vacuum Gauge Controller |
ATM ~ 1.0E-10Torr |
Power Supply Unit |
6kW, 8kW, 10kW |
Crucible Size |
4cc, 7cc, 15cc, 25cc |
Pocket Number |
Single, 4, 6 |
Film Thickness Uniformity |
< ±5% |
Ultimate Pressure |
< 5.0E-7Torr |
System Control |
PLC based Semi-auto |
specifications
ITEM |
SPECIFICATIONS |
Process Chamber |
Stainless steel |
Vacuum Pumping Station |
Cryo / TMP |
Loadlock Chamber |
Top door, Stainless steel |
Substrate Unit |
Rotation / Heating / Cooling |
Sample Size |
4inch ~ |
Vacuum Gauge Controller |
ATM ~ 1.0E-10Torr |
Power Supply Unit |
6kW, 8kW, 10kW |
Crucible Size |
4cc, 7cc, 15cc, 25cc |
Pocket Number |
Single, 4, 6 |
Film Thickness Uniformity |
< ±5% |
Ultimate Pressure |
< 5.0E-7Torr |
System Control |
PLC based Semi-auto |
System Control
Pumping The figure shows the pumping screen. Pumping screens have valves and pumps. The pump and valve are easily operated with one touch. |
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The picture shows the pocket screen. When you press the poc ket button on this screen, the e-beam index rotates and you can see the source you selected. |
Interlock This picture shows the interlock screen. Basically, the interlock is set so that it does not work when you deviate from the correct method of use for your safety. |
|
System Control
Pumping The figure shows the pumping screen. Pumping screens have valves and pumps. The pump and valve are easily operated with one touch. |
![]() |
|
The picture shows the pocket screen. When you press the poc ket button on this screen, the e-beam index rotates and you can see the source you selected. |
Interlock This picture shows the interlock screen. Basically, the interlock is set so that it does not work when you deviate from the correct method of use for your safety. |
|