Overview
An evaporator uses an electric resistance heater or high-energy beam to melt material
and to raise its vapor pressure to a useful range. This process takes place in a high
vacuum state to allow the vapor to reach the substrate without reacting with or
scattering against other gas-phase atoms in the chamber while reducing the
incorporation of impurities from the residual gas in the vacuum chamber. The KVE Series
evaporation systems are capable of fabricating multi-layer thin films by applying this
co-deposition process.
Features
≻ Excellent Thickness Uniformity
The KVE Series KVE-E2000 System provide excellent thickness uniformity of
resultant films even for substrates that have the same diameter as the sputtering cathode assembly
≻ No loadlock chamber
≻ Semi-auto system control by PLC
Overview
An evaporator uses an electric resistance heater or high-energy beam to melt material
and to raise its vapor pressure to a useful range. This process takes place in a high
vacuum state to allow the vapor to reach the substrate without reacting with or
scattering against other gas-phase atoms in the chamber while reducing the
incorporation of impurities from the residual gas in the vacuum chamber. The KVE Series
evaporation systems are capable of fabricating multi-layer thin films by applying this
co-deposition process.
Features
≻ Excellent Thickness Uniformity
The KVE Series KVE-E2000 System provide excellent thickness uniformity of
resultant films even for substrates that have the same diameter as the sputtering cathode assembly
≻ No loadlock chamber
≻ Semi-auto system control by PLC
Specifications
ITEM
|
SPECIFICATIONS
|
Process Chamber
|
Stainless steel
|
Vacuum Pumping Station
|
Cryo / TMP
|
Loadlock Chamber
|
N/A
|
Substrate Unit
|
Rotation / Heating / Cooling
|
Sample Size
|
4inch ~
|
Vacuum Gauge Controller
|
ATM ~ 1.0E-10Torr
|
Power Supply Unit
|
6kW, 8kW, 10kW
|
Crucible Size
|
4cc, 7cc, 15cc, 25cc
|
Pocket Number
|
Single, 4, 6
|
Film Thickness Uniformity
|
< ±5%
|
Ultimate Pressure
|
< 5.0E-7Torr
|
System Control
|
PLC based Semi-auto |
Specifications
ITEM
|
SPECIFICATIONS
|
Process Chamber
|
Stainless steel
|
Vacuum Pumping Station
|
Cryo / TMP
|
Loadlock Chamber
|
N/A
|
Substrate Unit
|
Rotation / Heating / Cooling
|
Sample Size
|
4inch ~
|
Vacuum Gauge Controller
|
ATM ~ 1.0E-10Torr
|
Power Supply Unit
|
6kW, 8kW, 10kW
|
Crucible Size
|
4cc, 7cc, 15cc, 25cc
|
Pocket Number
|
Single, 4, 6
|
Film Thickness Uniformity
|
< ±5%
|
Ultimate Pressure
|
< 5.0E-7Torr
|
System Control
|
PLC based Semi-auto
|
System Control
Pumping The figure shows the pumping screen. Pumping screens have valves and pumps. The pump and valve are easily operated with one touch. |
![]() |
![]() |
The picture shows the pocket screen. When you press the poc ket button on this screen, the e-beam index rotates and you can see the source you selected. |
Interlock This picture shows the interlock screen. Basically, the interlock is set so that it does not work when you deviate from the correct method of use for your safety. |
|
System Control
Pumping The figure shows the pumping screen. Pumping screens have valves and pumps. The pump and valve are easily operated with one touch. |
![]() |
![]() |
The picture shows the pocket screen. When you press the poc ket button on this screen, the e-beam index rotates and you can see the source you selected. |
Interlock This picture shows the interlock screen. Basically, the interlock is set so that it does not work when you deviate from the correct method of use for your safety. |
|