KVET-R4000 > ETHCHER
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제품 정보
제품 상세설명
Overview
Reactive ion Etching (RIE) is an etching technology that utilizes chemically reactive
plasma to remove masked materials deposited on wafers during microfabrication. The
combination of an electromagnetic field in a low pressure (vacuum) environment is
used to create a plasma source from which high energy ions attack a wafer surface and
react.
Features
≻ High selectivity, uniform plasma etching
≻ Simple configuration makes maintenance easy
≻ Negative self-bias forms on lower electrode
≻ Low damage & contamination
Overview
Reactive ion Etching (RIE) is an etching technology that utilizes chemically reactive
plasma to remove masked materials deposited on wafers during microfabrication. The
combination of an electromagnetic field in a low pressure (vacuum) environment is
used to create a plasma source from which high energy ions attack a wafer surface and
react.
Features
≻ High selectivity, uniform plasma etching
≻ Simple configuration makes maintenance easy
≻ Negative self-bias forms on lower electrode
≻ Low damage & contamination
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Specifications
제품 Specifications
Specifications
ITEM
SPECIFICATIONS
System configuration
R&D
Substrate size
2” - 6” (50.8mm - 150mm)
Operating pressure (Torr)
< 30mTorr
Uniformity within substrate /
substrate to substrate surfaces
± 5% max.
Process Chamber
Al anodized Chamber
Substrate
Heating or cooling / Bias
Ultimate Pressure
1.0E-6Torr
Gas Nozzle
6” - 8” shower head type
Specifications
ITEM
SPECIFICATIONS
System configuration
R&D
Substrate size
2” - 6” (50.8mm - 150mm)
Operating pressure (Torr)
< 30mTorr
Uniformity within substrate /
substrate to substrate surfaces
± 5% max.
Process Chamber
Al anodized Chamber
Substrate
Heating or cooling / Bias
Ultimate Pressure
1.0E-6Torr
Gas Nozzle
6” - 8” shower head type
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Options
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Control
제품 Control
System Control
Vacuum
This screen shows the vacuum screen. This screen consists of each valve, pump action button, automatic button. The automatic function provides convenience to the user. if you proceed with these buttons in sequence, one sample will be completed.
Recipe
The figure shows the recipe screen. This screen contains boxes for entering the process conditions required for deposition. Input all the boxes and press the Process button to automatically deposit according to the input process conditions.
Process
The figure shows the process screen. This screen shows the buttons that can control the gas flow rate, valve, power etc. required for the process.
Graph
The figure shows the graph screen. This screen shows vacuum degree, power amount, deposition rate, thickness and so on. You can record that data and make it into a file and compare it with the previous data.
Message
The picture is a graph screen. The picture consists of status message notification messages
System Control
Vacuum
This screen shows the vacuum screen. This screen consists of each valve, pump action button, automatic button. The automatic function provides convenience to the user. if you proceed with these buttons in sequence, one sample will be completed.
Recipe
The figure shows the recipe screen. This screen contains boxes for entering the process conditions required for deposition. Input all the boxes and press the Process button to automatically deposit according to the input process conditions.
Process
The figure shows the process screen. This screen shows the buttons that can control the gas flow rate, valve, power etc. required for the process.
Graph
The figure shows the graph screen. This screen shows vacuum degree, power amount, deposition rate, thickness and so on. You can record that data and make it into a file and compare it with the previous data.
Message
The picture is a graph screen. The picture consists of status message notification messages
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사용후기
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상품문의
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배송/교환정보
[배송]
배송 안내 입력전입니다.[교환]
교환/반품 안내 입력전입니다.
선택된 옵션
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KVET-R4000+0원
