Overview
Ion-Beam etching is a versatile process for pattern delineation and material modification.
The low pressure, line-of-sight nature of beam techniques provides a flexibility of
directional bombardment not available in other plasma processes. The ability to etch
virtually any material by the sputtering process opens a wide variety of diverse
applications.
Features
≻ High selectivity, uniform plasma
≻ Simple configuration makes maintenance easy
≻ The physical and chemical etching systems are controlled independently
≻ Low damage & contamination
≻ Physical etching using Ar Ion-Beam distributes reactive gases such as Cl2, He, BCl3 evenly around substrate.
Overview
Ion-Beam etching is a versatile process for pattern delineation and material modification.
The low pressure, line-of-sight nature of beam techniques provides a flexibility of
directional bombardment not available in other plasma processes. The ability to etch
virtually any material by the sputtering process opens a wide variety of diverse
applications.
Features
≻ High selectivity, uniform plasma
≻ Simple configuration makes maintenance easy
≻ The physical and chemical etching systems are controlled independently
≻ Low damage & contamination
≻ Physical etching using Ar Ion-Beam distributes reactive gases such as Cl2, He, BCl3 evenly around substrate.
Specifications
ITEM |
SPECIFICATIONS |
System configuration |
R&D |
Substrate size
|
2” - 6” (50.8mm - 150mm) |
Operation pressure (Torr)
|
> 1.0E-4 Torr
|
Uniformity within substrate / substrate to substrate surfaces |
± 5% max |
Ion source |
3cm ~ 20scm (@1” ~ 8”) |
Substrate |
Tilt / Rotation / Cooling |
Ultimate Pressure |
1.0E-6Torr |
Specifications
ITEM |
SPECIFICATIONS |
System configuration |
R&D |
Substrate size
|
2” - 6” (50.8mm - 150mm) |
Operation pressure (Torr)
|
> 1.0E-4 Torr
|
Uniformity within substrate / substrate to substrate surfaces |
± 5% max |
Ion source |
3cm ~ 20scm (@1” ~ 8”) |
Substrate |
Tilt / Rotation / Cooling |
Ultimate Pressure |
1.0E-6Torr |
System Control
Pumping
The figure shows the pumping screen. Pumping screens
have valves and pumps. The pump and valve are easily
operated with one touch.
|
|
|
Process Control
This picture shows the substrate tilt, shutter, rotation, gas valve control screen. |
Interlock
This picture shows the interlock screen. Basically, the
nterlock is set so that it does not work when you deviate
from the correct method of use for your safety.
|
|
System Control
Pumping
The figure shows the pumping screen. Pumping screens
have valves and pumps. The pump and valve are easily
operated with one touch.
|
|
|
Process Control
This picture shows the substrate tilt, shutter, rotation, gas valve control screen. |
Interlock
This picture shows the interlock screen. Basically, the
nterlock is set so that it does not work when you deviate
from the correct method of use for your safety.
|
|