JDR-I Series > ETCHER
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제품 정보
제품 상세설명
Overview
Ion beam etching is a microfabrication process essential for fabricating Josephson junctions.
Josephson junctions, which involve nanometer-thick insulating and superconducting layers, require extreme precision. Ion beam etching selectively removes only unnecessary components, creating a clean and uniform junction surface and optimizing intermetal contact characteristics to ensure stable supercurrent flow. This precision processing technology is a key enabler for high-performance qubit implementation and large-scale quantum chip fabrication.
Overview
Ion beam etching is a microfabrication process essential for fabricating Josephson junctions.
Josephson junctions, which involve nanometer-thick insulating and superconducting layers, require extreme precision. Ion beam etching selectively removes only unnecessary components, creating a clean and uniform junction surface and optimizing intermetal contact characteristics to ensure stable supercurrent flow. This precision processing technology is a key enabler for high-performance qubit implementation and large-scale quantum chip fabrication.
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Specifications
제품 Specifications
Specifications
ITEM
SPECIFICATIONS
Process Chamber
Stainless steel
Vacuum Pumping Station
Turbo molecular pump + R.P/D.P
Loadlock Chamber
Option
Substrate Unit
4”, 6” Tilt Type
Sample Loading/Unloading Unit
Full auto / Semi-auto (with loadlock chamber)
Pressure Control Unit
Automatic
Vacuum Gauge Controller
ATM ~ 1.0E-10Torr
Gas Supply Unit
MFC (Ar, O2, N2, H2, etc..)
Power Supply Unit
RF ICP / ECR
Film Thickness Uniformity
Less than ± 2.99 %
Ultimate Pressure
Less than 1.99E-7 Torr
Specifications
ITEM
SPECIFICATIONS
Process Chamber
Stainless steel
Vacuum Pumping Station
Turbo molecular pump + R.P/D.P
Loadlock Chamber
Option
Substrate Unit
4”, 6” Tilt Type
Sample Loading/Unloading Unit
Full auto / Semi-auto (with loadlock chamber)
Pressure Control Unit
Automatic
Vacuum Gauge Controller
ATM ~ 1.0E-10Torr
Gas Supply Unit
MFC (Ar, O2, N2, H2, etc..)
Power Supply Unit
RF ICP / ECR
Film Thickness Uniformity
Less than ± 2.99 %
Ultimate Pressure
Less than 1.99E-7 Torr
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Options
제품 Options
Options
- Loadlock Chamber
- Ion Source
- Reactive Gas
- Automatic Control
- Etc... user requirements
Options
- Loadlock Chamber
- Ion Source
- Reactive Gas
- Automatic Control
- Etc... user requirements
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Control
제품 Control
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사용후기
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상품문의
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배송/교환정보
[배송]
배송 안내 입력전입니다.[교환]
교환/반품 안내 입력전입니다.
선택된 옵션
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JDR-I Series+0원
