Overview

Sputter deposition is a technique used to deposit thin films of a material onto a surface

(substrate). Atoms and ions of a given material are made to collide. The resulting

momentum exchange disperses incident ions which further perpetuate activity setting

off collision cascades in the target. This activity drives the sputtering process. When

such cascades recoil and reach the target surface with an energy above the surface

binding energy, and atom can be ejected. If the target is thin on an atomic scale the

collision cascade can reach the back side of the target and atoms can escape the

surface binding energy in transmission. The average number of atoms ejected from the

target per incident ion is called the “sputter yield” and depends on the ion incident

angle, the energy of the ion, the masses of the ion and target atoms, and the surface

binding energy of atoms in the target.

Features

≻ Excellent Thickness Uniformity

        The KVS Series RF&DC Sputtering System provide excellent thickness uniformity of resultant films even for substrates

        that have the same diameter as the sputtering cathode assembly

    ≻ No loadlock chamber

≻ Semi-auto system control by PLC

Specifications

Options

- UHV Type Chamber(Less than 9.90E-9 Torr) 

- Loadlock Chamber

- Power Selection

- Plasma Cleaning

- RF/DC Bias Heater

- Automatic Control

- Etc... user requirements

System Control