Overview
Sputter deposition is a technique used to deposit thin films of a material onto a surface
(substrate). Atoms and ions of a given material are made to collide. The resulting
momentum exchange disperses incident ions which further perpetuate activity setting
off collision cascades in the target. This activity drives the sputtering process. When
such cascades recoil and reach the target surface with an energy above the surface
binding energy, and atom can be ejected. If the target is thin on an atomic scale the
collision cascade can reach the back side of the target and atoms can escape the
surface binding energy in transmission. The average number of atoms ejected from the
target per incident ion is called the “sputter yield” and depends on the ion incident
angle, the energy of the ion, the masses of the ion and target atoms, and the surface
binding energy of atoms in the target.
Features
≻ Excellent Thickness Uniformity
The KVS Series RF&DC Sputtering System provide excellent thickness uniformity of
resultant films even for substrates that have the same diameter as the sputtering cathode assembly
≻ Full Auto control
These systems provide the ‘auto button’ to user for convenience of user. Fully automated vacuum
process control system.
≻ No Loadlock chamber
Overview
Sputter deposition is a technique used to deposit thin films of a material onto a surface
(substrate). Atoms and ions of a given material are made to collide. The resulting
momentum exchange disperses incident ions which further perpetuate activity setting
off collision cascades in the target. This activity drives the sputtering process. When
such cascades recoil and reach the target surface with an energy above the surface
binding energy, and atom can be ejected. If the target is thin on an atomic scale the
collision cascade can reach the back side of the target and atoms can escape the
surface binding energy in transmission. The average number of atoms ejected from the
target per incident ion is called the “sputter yield” and depends on the ion incident
angle, the energy of the ion, the masses of the ion and target atoms, and the surface
binding energy of atoms in the target.
Features
≻ Excellent Thickness Uniformity
The KVS Series RF&DC Sputtering System provide excellent thickness uniformity of
resultant films even for substrates that have the same diameter as the sputtering cathode assembly
≻ Full Auto control
These systems provide the ‘auto button’ to user for convenience of user. Fully automated vacuum
process control system.
≻ No Loadlock chamber
Specifications
ITEM |
SPECIFICATIONS |
Process Chamber |
Stainless steel |
Vacuum Pumping Station |
Turbo molecular pump |
Loadlock Chamber |
Stainless steel |
Substrate Heating Unit |
SiC / 2”, 3”, 4”, 6”, 8” |
Sample Loading/Unloading Unit |
Full auto / Semi-auto |
Pressure Control Unit |
Auto |
Vacuum Gauge Controller |
ATM ~ 1.0E-10Torr |
Gas Supply Unit |
MFC (Ar, O2, N2, H2, etc..) |
Power Supply Unit |
RF / DC / Pulsed DC |
Target Size |
2”, 3”, 4”, 6” |
Film Thickness Uniformity |
Less than ±5% |
Ultimate Pressure |
Less than 5.0E-7Torr |
Specifications
ITEM |
SPECIFICATIONS |
Process Chamber |
Stainless steel |
Vacuum Pumping Station |
Turbo molecular pump |
Loadlock Chamber |
Stainless steel |
Substrate Heating Unit |
SiC / 2”, 3”, 4”, 6”, 8” |
Sample Loading/Unloading Unit |
Full auto / Semi-auto |
Pressure Control Unit |
Auto |
Vacuum Gauge Controller |
ATM ~ 1.0E-10Torr |
Gas Supply Unit |
MFC (Ar, O2, N2, H2, etc..) |
Power Supply Unit |
RF / DC / Pulsed DC |
Target Size |
2”, 3”, 4”, 6” |
Film Thickness Uniformity |
Less than ±5% |
Ultimate Pressure |
Less than 5.0E-7Torr |
System Control
Vacuum
This screen shows the pumping screen. This screen consists of each valve, pump action button, automatic button.The biggest difference from Semi Auto is the automatic button, so if you proceed with these buttons in sequence, one sample will be completed.
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Process
The figure shows the process screen. This screen shows the buttons that can control the gas flow rate, valve, power etc. required for the process.
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Recipe
The figure shows the recipe screen. This screen contains boxes for entering the process conditions required for deposition. Input all the boxes and press the process button to automatically deposit according to the input process conditions.
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Transfer
The figure shows the Transfer screen. In this screen, there are buttons that allow you to manipulate the part you will use to move samples from the load lock chamber to the process chamber, such as the loading arm, z-motion. |
Graph
The figure shows the graph screen. This screen shows vacuum degree, power amount, deposition rate, thickness and so on. You can record that data and make it into a file and compare it with the previous data.
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Message
The picture is a graph screen. The picture consists of status message notification messages
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System Control
Vacuum
This screen shows the pumping screen. This screen consists of each valve, pump action button, automatic button.The biggest difference from Semi Auto is the automatic button, so if you proceed with these buttons in sequence, one sample will be completed.
|
|
|
Process
The figure shows the process screen. This screen shows the buttons that can control the gas flow rate, valve, power etc. required for the process.
|
Recipe
The figure shows the recipe screen. This screen contains boxes for entering the process conditions required for deposition. Input all the boxes and press the process button to automatically deposit according to the input process conditions.
|
|
|
Transfer
The figure shows the Transfer screen. In this screen, there are buttons that allow you to manipulate the part you will use to move samples from the load lock chamber to the process chamber, such as the loading arm, z-motion. |
Graph
The figure shows the graph screen. This screen shows vacuum degree, power amount, deposition rate, thickness and so on. You can record that data and make it into a file and compare it with the previous data.
|
|
|
Message
The picture is a graph screen. The picture consists of status message notification messages
|