KVS-4000 > Sputter
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KVS-4000 요약정보 및 구매

SPUTTER VACUUM EQUIPMENTS

Excellent Thickness Uniformity

The RF and DC Sputtering System from Korea Vacuum Tech, Ltd. provides excellent thickness uniformity of resultant films even for substrates that are the same diameter as the sputtering cathode assembly.

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  • 제품 정보

    제품 상세설명

    Overview


     

    Sputter deposition is a technique used to deposit thin films of a material onto a surface

     

    (substrate). Atoms and ions of a given material are made to collide. The resulting

     

    momentum exchange disperses incident ions which further perpetuate activity setting

     

    off collision cascades in the target. This activity drives the sputtering process. When

     

    such cascades recoil and reach the target surface with an energy above the surface

     

    binding energy, and atom can be ejected. If the target is thin on an atomic scale the

     

    collision cascade can reach the back side of the target and atoms can escape the

     

    surface binding energy in transmission. The average number of atoms ejected from the

     

    target per incident ion is called the “sputter yield” and depends on the ion incident

     

    angle, the energy of the ion, the masses of the ion and target atoms, and the surface

     

    binding energy of atoms in the target.



    Features

     

     Excellent Thickness Uniformity

            The KVS Series RF&DC Sputtering System provide excellent thickness uniformity of

            resultant films even for substrates that have the same diameter as the sputtering cathode assembly


     Full Auto control

            These systems provide the ‘auto button’ to user for convenience of user. Fully automated vacuum

            process control system.


     No Loadlock chamber

    Overview


     

    Sputter deposition is a technique used to deposit thin films of a material onto a surface

     

    (substrate). Atoms and ions of a given material are made to collide. The resulting

     

    momentum exchange disperses incident ions which further perpetuate activity setting

     

    off collision cascades in the target. This activity drives the sputtering process. When

     

    such cascades recoil and reach the target surface with an energy above the surface

     

    binding energy, and atom can be ejected. If the target is thin on an atomic scale the

     

    collision cascade can reach the back side of the target and atoms can escape the

     

    surface binding energy in transmission. The average number of atoms ejected from the

     

    target per incident ion is called the “sputter yield” and depends on the ion incident

     

    angle, the energy of the ion, the masses of the ion and target atoms, and the surface

     

    binding energy of atoms in the target.



    Features

     

     Excellent Thickness Uniformity

            The KVS Series RF&DC Sputtering System provide excellent thickness uniformity of

            resultant films even for substrates that have the same diameter as the sputtering cathode assembly


     Full Auto control

            These systems provide the ‘auto button’ to user for convenience of user. Fully automated vacuum

            process control system.


     No Loadlock chamber

  • Specifications

    제품 Specifications

     


    Specifications

     

    ITEM

    SPECIFICATIONS

    Process Chamber 

    Stainless steel 

    Vacuum Pumping Station 

    Turbo molecular pump 

    Loadlock Chamber 

    Stainless steel 

    Substrate Heating Unit 

    SiC / 2”, 3”, 4”, 6”, 8” 

    Sample Loading/Unloading Unit 

    Full auto / Semi-auto 

    Pressure Control Unit 

    Auto 

    Vacuum Gauge Controller 

    ATM ~ 1.0E-10Torr 

    Gas Supply Unit 

    MFC (Ar, O2, N2, H2, etc..) 

    Power Supply Unit 

    RF / DC / Pulsed DC 

    Target Size 

    2”, 3”, 4”, 6” 

    Film Thickness Uniformity 

    Less than ±5% 

    Ultimate Pressure 

    Less than 5.0E-7Torr 

     


    Specifications

     

    ITEM

    SPECIFICATIONS

    Process Chamber 

    Stainless steel 

    Vacuum Pumping Station 

    Turbo molecular pump 

    Loadlock Chamber 

    Stainless steel 

    Substrate Heating Unit 

    SiC / 2”, 3”, 4”, 6”, 8” 

    Sample Loading/Unloading Unit 

    Full auto / Semi-auto 

    Pressure Control Unit 

    Auto 

    Vacuum Gauge Controller 

    ATM ~ 1.0E-10Torr 

    Gas Supply Unit 

    MFC (Ar, O2, N2, H2, etc..) 

    Power Supply Unit 

    RF / DC / Pulsed DC 

    Target Size 

    2”, 3”, 4”, 6” 

    Film Thickness Uniformity 

    Less than ±5% 

    Ultimate Pressure 

    Less than 5.0E-7Torr 

  • Options

  • Control

    제품 Control


    System Control


     

     

     


      Vacuum


       This screen shows the pumping screen. This 

      screen consists of each valve, pump action button, 

      automatic button.The biggest difference from Semi 

      Auto is the automatic button, so if you proceed with 

      these buttons in sequence, one sample will 

      be completed.



     


    o_1bttv1tn9if21fmt1jrk1a79rvqa.png


    o_1bttv2gu51qkr16jckrcukvhg3a.png

     



       Process


       The figure shows the process screen. This screen shows the

      buttons that can control the gas flow rate, valve, power etc.

      required for the process.




       Recipe


       The figure shows the recipe screen. This screen 

      contains boxes for entering the process conditions 

      required for deposition. Input all the boxes and press 

      the process button to automatically deposit according 

      to the input process conditions.



    o_1bttv4qt7f94j40odm11l913sla.png

    o_1bttv5cet12v1ffhkv6hsu1jfoa.png


     

       Transfer

     

       The figure shows the Transfer screen. In this screen, there 

      are buttons that allow you to manipulate the part you will  

      use to move samples from the load lock chamber to the 

      process chamber, such as the loading arm, z-motion.


     

       Graph

     

       The figure shows the graph screen. This screen shows 

       vacuum degree, power amount, deposition rate, 

      thickness and so on. You can record that data and 

      make it into a file and compare it with the previous 

      data.





    o_1bttv5s7n1o851oai11ff1bb619bta.png


    o_1bttv68rl1qiu1e4ic901q4t10dha.png

     

      Message

     

      The picture is a graph screen. The picture consists of status     message notification messages



     

    System Control


     

     

     


      Vacuum


       This screen shows the pumping screen. This 

      screen consists of each valve, pump action button, 

      automatic button.The biggest difference from Semi 

      Auto is the automatic button, so if you proceed with 

      these buttons in sequence, one sample will 

      be completed.



     


    o_1bttv1tn9if21fmt1jrk1a79rvqa.png


    o_1bttv2gu51qkr16jckrcukvhg3a.png

     



       Process


       The figure shows the process screen. This screen shows the

      buttons that can control the gas flow rate, valve, power etc.

      required for the process.




       Recipe


       The figure shows the recipe screen. This screen 

      contains boxes for entering the process conditions 

      required for deposition. Input all the boxes and press 

      the process button to automatically deposit according 

      to the input process conditions.



    o_1bttv4qt7f94j40odm11l913sla.png

    o_1bttv5cet12v1ffhkv6hsu1jfoa.png


     

       Transfer

     

       The figure shows the Transfer screen. In this screen, there 

      are buttons that allow you to manipulate the part you will  

      use to move samples from the load lock chamber to the 

      process chamber, such as the loading arm, z-motion.


     

       Graph

     

       The figure shows the graph screen. This screen shows 

       vacuum degree, power amount, deposition rate, 

      thickness and so on. You can record that data and 

      make it into a file and compare it with the previous 

      data.





    o_1bttv5s7n1o851oai11ff1bb619bta.png


    o_1bttv68rl1qiu1e4ic901q4t10dha.png

     

      Message

     

      The picture is a graph screen. The picture consists of status     message notification messages


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