KVIS-4000L > Sputter
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제품 정보
제품 상세설명
Overview
Sputter deposition is a technique used to deposit thin films of a material onto a surface
(substrate). Atoms and ions of a given material are made to collide. The resulting
momentum exchange disperses incident ions which further perpetuate activity setting
off collision cascades in the target. This activity drives the sputtering process. When
such cascades recoil and reach the target surface with an energy above the surface
binding energy, and atom can be ejected. If the target is thin on an atomic scale the
collision cascade can reach the back side of the target and atoms can escape the
surface binding energy in transmission. The average number of atoms ejected from the
target per incident ion is called the “sputter yield” and depends on the ion incident
angle, the energy of the ion, the masses of the ion and target atoms, and the surface
binding energy of atoms in the target.
Features
≻ Ion Beam Sputtering
Permits independent control over the energy and the current density of the bombarding ions.
≻ Ion Beam Sources
Permits Sputtered coatings to be deposited at very low inert working-gas pressure (<10-4Torr)
onto substrates not in contact with a plasma.
≻ Good Film Thickness Uniformity
Even with targets of same diameter as substrate.
≻ Low Pressure Process
Maintains discharge at a pressure range of about 10-4Torr (roughly one order of magnitude
lower than the conventional sputter discharge pressure.)
Overview
Sputter deposition is a technique used to deposit thin films of a material onto a surface
(substrate). Atoms and ions of a given material are made to collide. The resulting
momentum exchange disperses incident ions which further perpetuate activity setting
off collision cascades in the target. This activity drives the sputtering process. When
such cascades recoil and reach the target surface with an energy above the surface
binding energy, and atom can be ejected. If the target is thin on an atomic scale the
collision cascade can reach the back side of the target and atoms can escape the
surface binding energy in transmission. The average number of atoms ejected from the
target per incident ion is called the “sputter yield” and depends on the ion incident
angle, the energy of the ion, the masses of the ion and target atoms, and the surface
binding energy of atoms in the target.
Features
≻ Ion Beam Sputtering
Permits independent control over the energy and the current density of the bombarding ions.
≻ Ion Beam Sources
Permits Sputtered coatings to be deposited at very low inert working-gas pressure (<10-4Torr)
onto substrates not in contact with a plasma.
≻ Good Film Thickness Uniformity
Even with targets of same diameter as substrate.
≻ Low Pressure Process
Maintains discharge at a pressure range of about 10-4Torr (roughly one order of magnitude
lower than the conventional sputter discharge pressure.)
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Specifications
제품 Specifications
Specifications
ITEM
SPECIFICATIONS
Process Chamber
Stainless steel
Vacuum Pumping Station
Turbo molecular pump
Loadlock Chamber
N/A (Optional item)
Substrate Heating Unit
SiC / 4”, 6”, 8”
Sample Loading/Unloading Unit
N/A (Optional item w / Loadlock chamber)
Pressure Control Unit
Auto / Semi-auto
Vacuum Gauge Controller
Vacuum Gauge Controller
Gas Supply Unit
Gas Supply Unit
Power Supply Unit
RF
Target Size
2”, 3”, 4”, 6”
Film Thickness Uniformity
Less than ±5%
Ultimate Pressure
Less than 5.0E-7Torr
Specifications
ITEM
SPECIFICATIONS
Process Chamber
Stainless steel
Vacuum Pumping Station
Turbo molecular pump
Loadlock Chamber
N/A (Optional item)
Substrate Heating Unit
SiC / 4”, 6”, 8”
Sample Loading/Unloading Unit
N/A (Optional item w / Loadlock chamber)
Pressure Control Unit
Auto / Semi-auto
Vacuum Gauge Controller
Vacuum Gauge Controller
Gas Supply Unit
Gas Supply Unit
Power Supply Unit
RF
Target Size
2”, 3”, 4”, 6”
Film Thickness Uniformity
Less than ±5%
Ultimate Pressure
Less than 5.0E-7Torr
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Options
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Control
제품 Control
System Control
Vacuum
This screen shows the pumping screen. This screen consists of
each valve, pump action button, automatic button. The biggest
difference from Semi Auto is the automatic button, so if you
proceed with these buttons in sequence, one sample will be
completed.
Process
The figure shows the process screen. This screen shows the
buttons that can control the gas flow rate, valve, power etc.
required for the process.
Recipe
The figure shows the recipe screen. This screen contains boxes
for entering the process conditions required for deposition. Input
all the boxes and press the Process button to automatically
deposit according to the input process conditions.
Transfer
The figure shows the Transfer screen. In this screen, there
are buttons that allow you to manipulate the part you will use
to move samples from the load lock chamber to the process
chamber, such as the loading arm, z-motion.
Graph
The figure shows the graph screen. This screen shows vacuum
degree, power amount, deposition rate, thickness and so on.
You can record that data and make it into a file and compare it
with the previous data.
Message
The picture is a graph screen. The picture consists of status
message notification messages
System Control
Vacuum
This screen shows the pumping screen. This screen consists of
each valve, pump action button, automatic button. The biggest
difference from Semi Auto is the automatic button, so if you
proceed with these buttons in sequence, one sample will be
completed.
Process
The figure shows the process screen. This screen shows the
buttons that can control the gas flow rate, valve, power etc.
required for the process.
Recipe
The figure shows the recipe screen. This screen contains boxes
for entering the process conditions required for deposition. Input
all the boxes and press the Process button to automatically
deposit according to the input process conditions.
Transfer
The figure shows the Transfer screen. In this screen, there
are buttons that allow you to manipulate the part you will use
to move samples from the load lock chamber to the process
chamber, such as the loading arm, z-motion.
Graph
The figure shows the graph screen. This screen shows vacuum
degree, power amount, deposition rate, thickness and so on.
You can record that data and make it into a file and compare it
with the previous data.
Message
The picture is a graph screen. The picture consists of status
message notification messages
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사용후기
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상품문의
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배송/교환정보
[배송]
배송 안내 입력전입니다.[교환]
교환/반품 안내 입력전입니다.
선택된 옵션
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KVIS-4000L+0원
