Overview

Sputter deposition is a technique used to deposit thin films of a material onto a surface

(substrate). Atoms and ions of a given material are made to collide. The resulting

momentum exchange disperses incident ions which further perpetuate activity setting

off collision cascades in the target. This activity drives the sputtering process. When

such cascades recoil and reach the target surface with an energy above the surface

binding energy, and atom can be ejected. If the target is thin on an atomic scale the

collision cascade can reach the back side of the target and atoms can escape the

surface binding energy in transmission. The average number of atoms ejected from the

target per incident ion is called the “sputter yield” and depends on the ion incident

angle, the energy of the ion, the masses of the ion and target atoms, and the surface

Features

≻ Ideal for Individual Sputtering of metal and non-metal

≻ Multi-Layer Deposition

        Multiple cathode assemblies provide for sequential multi-layer or complex alloy deposition in Situ.

≻ Cross driven wafer transfer

        These systems have two process chamber and one loadlock chamber. After process chamber

        has been completed the process, wafer transfer equipment transports the sample to another chamber automatically.

Specifications

 System Control