Cluster Sputtering System > Sputter
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제품 정보
제품 상세설명
Overview
The cluster sputter system is based on sputtering technology, which deposits thin films by colliding ions with metal or compound targets in a vacuum. It is a complex mass production platform in which multiple process chambers are combined around a single transfer module.
As this system enables continuous processing without atmospheric exposure, it has established itself as a standard solution for high-tech industries requiring both high-purity thin film deposition and high productivity.
Overview
The cluster sputter system is based on sputtering technology, which deposits thin films by colliding ions with metal or compound targets in a vacuum. It is a complex mass production platform in which multiple process chambers are combined around a single transfer module.
As this system enables continuous processing without atmospheric exposure, it has established itself as a standard solution for high-tech industries requiring both high-purity thin film deposition and high productivity.
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Specifications
제품 Specifications
Specifications
1) Max sample size : 300mm wafer
2) Uniformity :Less than ± 2.99 %
3) Ultimate Pressure :Less than 1.99E-7 Torr(UHV Type 9.90E-9 Torr)
Specifications
1) Max sample size : 300mm wafer
2) Uniformity :Less than ± 2.99 %
3) Ultimate Pressure :Less than 1.99E-7 Torr(UHV Type 9.90E-9 Torr)
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Options
제품 Options
Options
- Etc... user requirements
Options
- Etc... user requirements
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Control
제품 Control
System Control
- Etc... user requirements
System Control
- Etc... user requirements
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사용후기
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상품문의
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배송/교환정보
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교환/반품 안내 입력전입니다.
선택된 옵션
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Cluster Sputtering System+0원
