JDR-IS Series > Sputter
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제품 정보
제품 상세설명
Overview
Josephson junction fabrication requires extreme precision, and ion beam etching and sputtering are key processes for achieving this. Ion beam etching selectively removes unnecessary film to ensure a clean and uniform bonding surface, while sputtering deposits a precise and uniform film of superconducting metals such as neodymium (Nb) or aluminum (Al).
Our integrated vacuum system is designed to perform these two processes continuously within a single chamber.
Contamination is minimized by eliminating sample exposure to the atmosphere between processes.
This system simultaneously meets the stability, precision, and efficiency demands of researchers and industrial sites, providing the optimal solution for the development of next-generation superconducting quantum computers.
Overview
Josephson junction fabrication requires extreme precision, and ion beam etching and sputtering are key processes for achieving this. Ion beam etching selectively removes unnecessary film to ensure a clean and uniform bonding surface, while sputtering deposits a precise and uniform film of superconducting metals such as neodymium (Nb) or aluminum (Al).
Our integrated vacuum system is designed to perform these two processes continuously within a single chamber.
Contamination is minimized by eliminating sample exposure to the atmosphere between processes.
This system simultaneously meets the stability, precision, and efficiency demands of researchers and industrial sites, providing the optimal solution for the development of next-generation superconducting quantum computers.
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Specifications
제품 Specifications
Specifications
ITEM
SPECIFICATIONS
Process Chamber
Stainless steel
Vacuum Pumping Station
Turbo molecular pump
Loadlock Chamber
Option
Substrate Heating Unit
SiC / 2”, 3”, 4”, 6"
Sample Loading/Unloading Unit
Option
Pressure Control Unit
Auto / Semi-auto / Manual
Vacuum Gauge Controller
ATM ~ 1.0E-10Torr
Ion Beam
Option
Power Supply Unit
RF / DC / Pulsed DC, Ion Source
Target Size
2”, 3",4"
Film Thickness Uniformity
Less than ± 2.99 %
Ultimate Pressure
Less than 1.99E-7 Torr
Specifications
ITEM
SPECIFICATIONS
Process Chamber
Stainless steel
Vacuum Pumping Station
Turbo molecular pump
Loadlock Chamber
Option
Substrate Heating Unit
SiC / 2”, 3”, 4”, 6"
Sample Loading/Unloading Unit
Option
Pressure Control Unit
Auto / Semi-auto / Manual
Vacuum Gauge Controller
ATM ~ 1.0E-10Torr
Ion Beam
Option
Power Supply Unit
RF / DC / Pulsed DC, Ion Source
Target Size
2”, 3",4"
Film Thickness Uniformity
Less than ± 2.99 %
Ultimate Pressure
Less than 1.99E-7 Torr
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Options
제품 Options
Options
- Loadlock Chamber
- Heater/Cooler
- Automatic Control
- Etc... user requirements
Options
- Loadlock Chamber
- Heater/Cooler
- Automatic Control
- Etc... user requirements
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Control
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사용후기
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상품문의
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배송/교환정보
[배송]
배송 안내 입력전입니다.[교환]
교환/반품 안내 입력전입니다.
선택된 옵션
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JDR-IS Series+0원
